IMAPS – THERMAL

Thermal management remains a crucial constraint in electronics packaging and is a mandatory aspect in every industry – aerospace, automotive, consumer, industrial, military – technology roadmap worldwide.

The upcoming workshop will present some latest improvements in thermal management solutions at system level, in power electronics, in materials, in modelling and in techniques for characterizing and testing materials. It will also present some innovative cooling solutions such as two-phase technologies and liquid cooling.

Call for Papers is in progress  – TOPICS :

• Cooling solutions for microelectronics packaging,
• Heat conductive materials at chip, board, sub-system and system levels,
• Advances in PCBs for thermal management, PCB embedded components included,
• Heatsinks, heat pipes and change phase materials,
• Liquid and phase change cooling,
• Thermal modeling and simulation, Machine Learning and AI optimization,
• Innovative cooling solutions,
• Thermal management of optoelectronics components (LEDs, IR sensors…),
• Overviews or examples of products, systems cooling, power electronics, automotive transport,
• Temperature-related or thermal cycles-related reliability of electronic components.

Sponsored by : SERMA Technologies

Programme et tarif : voir https://france.imapseurope.org/event/thermal-2025/