IMAPS – 17th Micropackaging and Thermal Management Workshop
La RochelleThe Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. Industry transition to SiC and GaN devices […]
