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Conception de composants \u00e9lectroniques de puissance utilisant une technologie grand gap (GaN > 650 V) : mise en boitier des puces<\/em><\/p>\n M\u00e9thode de tests engineering et en production de composants<\/em><\/p>\n Fiabilisation des composants \u00e9lectroniques de puissance 650 V pour les applications grand public et automobile<\/em><\/p>\n Analyse de d\u00e9faillance de composants \u00e9lectroniques<\/em><\/p>\n","protected":false},"featured_media":2311,"template":"","type_acteur":[10],"thematique":[115],"domaines":[102,101],"expertises":[103],"class_list":["post-2234","acteurs","type-acteurs","status-publish","has-post-thumbnail","hentry","type_acteur-industriels","thematique-fiabilite-des-composants-electroniques-et-leur-packaging","expertises-connaissances-et-moyens-dinvestigations-sur-les-materiaux-electriques-et-les-composants"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/acteurs\/2234","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/acteurs"}],"about":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/types\/acteurs"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/media\/2311"}],"wp:attachment":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/media?parent=2234"}],"wp:term":[{"taxonomy":"type_acteur","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/type_acteur?post=2234"},{"taxonomy":"thematique","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/thematique?post=2234"},{"taxonomy":"domaines","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/domaines?post=2234"},{"taxonomy":"expertises","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/expertises?post=2234"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}