{"id":3685,"date":"2023-05-17T15:00:43","date_gmt":"2023-05-17T13:00:43","guid":{"rendered":"https:\/\/www.cff-fiabilite.fr\/?post_type=tribe_events&#038;p=3685"},"modified":"2023-12-04T15:10:22","modified_gmt":"2023-12-04T14:10:22","slug":"imaps-micropackaging-and-thermal-management-workshop","status":"publish","type":"tribe_events","link":"https:\/\/www.cff-fiabilite.fr\/evenements\/imaps-micropackaging-and-thermal-management-workshop\/","title":{"rendered":"IMAPS &#8211; 17th Micropackaging and Thermal Management Workshop"},"content":{"rendered":"<p>The\u00a0Workshop\u00a0will present\u00a0improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and\u00a0sub-systems.<\/p>\n<p>Increases in\u00a0functionality, complexity, miniaturisation, operating temperature and power output\u00a0will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.<\/p>\n<p>Industry transition to\u00a0SiC and\u00a0GaN devices allows higher operating temperatures with higher heat flux\u00a0but also\u00a0greater reliability; these trends also require improvements and changes in packaging and thermal materials.<\/p>\n<p>Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels.<\/p>\n<hr \/>\n<div id=\"ts-body\">\n<div class=\"css-44 \">\n<div id=\"ContentContainer\">\n<div id=\"Lookup\" class=\"ts-pivot-lookup-component\">\n<div class=\"ms-Grid ts-grid\">\n<div class=\"ms-Grid-row\">\n<div class=\"ts-textfield-container \" lang=\"fr\">\n<div class=\"ts-alignment-view-container\">\n<div id=\"ts-alignment-view-idtgt\" class=\"ts-alignment-view ms-font-m ts-alignment-view-tgt ts-ltr-left-zero\" aria-hidden=\"false\">\n<div role=\"label\">L\u2019atelier pr\u00e9sentera des am\u00e9liorations dans les mat\u00e9riaux, les composants et les syst\u00e8mes de gestion thermique, afin de fournir des solutions innovantes d\u2019emballage et de refroidissement pour les dispositifs et sous-syst\u00e8mes d\u2019alimentation, RF, micro-ondes et autres hautement int\u00e9gr\u00e9s.<\/div>\n<div role=\"label\">L\u2019augmentation de la fonctionnalit\u00e9, de la complexit\u00e9, de la miniaturisation, de la temp\u00e9rature de fonctionnement et de la puissance de sortie n\u00e9cessitera des avanc\u00e9es dans les solutions thermiques \u00e0 de nombreux niveaux, pour les syst\u00e8mes militaires, a\u00e9rospatiaux, grand public et industriels.<\/div>\n<div role=\"label\">La transition de l\u2019industrie vers les dispositifs SiC et GaN permet des temp\u00e9ratures de fonctionnement plus \u00e9lev\u00e9es avec un flux de chaleur plus \u00e9lev\u00e9, mais aussi une plus grande fiabilit\u00e9 ;<\/div>\n<div role=\"label\">Ces tendances n\u00e9cessitent \u00e9galement des am\u00e9liorations et des changements dans les emballages et les mat\u00e9riaux thermiques.<\/div>\n<div role=\"label\">La gestion thermique a \u00e9t\u00e9 clairement identifi\u00e9e, dans les feuilles de route technologiques de l\u2019industrie \u00e0 travers le monde, comme une contrainte cruciale dans l\u2019emballage \u00e0 tous les niveaux.<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>The\u00a0Workshop\u00a0will present\u00a0improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and\u00a0sub-systems. Increases in\u00a0functionality, complexity, miniaturisation, [&hellip;]<\/p>\n","protected":false},"author":15,"featured_media":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","_tribe_events_status":"","_tribe_events_status_reason":"","footnotes":""},"tags":[],"tribe_events_cat":[97],"class_list":["post-3685","tribe_events","type-tribe_events","status-publish","hentry","tribe_events_cat-relaye-par-le-cff","cat_relaye-par-le-cff"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tribe_events\/3685","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tribe_events"}],"about":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/types\/tribe_events"}],"author":[{"embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/users\/15"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/comments?post=3685"}],"version-history":[{"count":4,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tribe_events\/3685\/revisions"}],"predecessor-version":[{"id":3937,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tribe_events\/3685\/revisions\/3937"}],"wp:attachment":[{"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/media?parent=3685"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tags?post=3685"},{"taxonomy":"tribe_events_cat","embeddable":true,"href":"https:\/\/www.cff-fiabilite.fr\/wp-json\/wp\/v2\/tribe_events_cat?post=3685"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}